Nanusens wins its third award of the year at the 2019 Elektra Awards
London, UK – 6 December 2019. After Nanusens’ success at the TechWorks Awards in October where it was the only company to win two awards, the company has gone on to win the Award for Best Campaign of the Year at the 2019 Elektra Awards, which are organised by Electronics Weekly.
Dr Josep Montanyà (centre) with award for Best Campaign of the Year
At the awards ceremony held in London on the 4th of December 2019, a delighted Dr Josep Montanyà, Nanusens CEO, said, “The Elektra Awards attract entries from around Europe so the competition is intense. We were up against long established giants of the electronics industry so for a young start-up to scoop this award and be a finalist for two others is a tremendous tribute to all the hard work of the Nanusens team turning our technology into a reality that will change the world of MEMS sensors.”
The judges commented: “This was an extremely successful campaign with a vastly oversubscribed Crowdcube crowdfunding process. Nanusens distilled fourteen years of development progress into an effective messaging campaign raising the awareness of their product to their target audience.”
What is game changing about Nanusens technology?
Nanusens is the first and only company to have perfected and to be patenting techniques to make the vital sensors that are needed for smart devices using only standard CMOS production techniques to make the world’s smallest sensors (nanosensors) in unlimited volumes.
- Unique ability to create many different sensors all on the same monolithic ASIC chip
- Unleashes a new world of design possibilities for better smarts in smarter devices
- Fundamental enabling technology for the next generation sensors that are a fraction of the size and cost of existing discrete sensor solutions
- Nanusens alone has the unlimited volume capability to solve the production constraint of existing, billion-dollar sensor industry, enabling it to grow to a trillion dollars plus
Current sensors and Nanusens breakthrough
Current sensors consist of two chips in a package. One has the MEMS (Micro Electro Mechanical System) sensor structure that is built on top of a piece of silicon. A second control chip is needed that is made in CMOS. The breakthrough by Nanusens is building everything using standard, high yield, CMOS techniques onto a single chip – MEMS-within-CMOS™.
How the sensor production problem is solved
Current sensors need a proprietary production line for every sensor structure chip so the only way to increase production is to build a duplicate line. As a result, the ever-increasing demand for sensors is outstripping production. As Nanusens nanosensors are completely made in CMOS with novel and patent-pending sensor structure designs, they can be made in unlimited volumes using tried and tested processes in the giant CMOS fabs such as TSMC and SMIC.
World’s smallest sensors
Sensors provide the awareness that enables devices to be smart. Designers want to add more and more sensors to create ever smarter devices but, currently, each packaged sensor takes up 4mm3, which soon adds up in small format devices such as smartphones, smartwatches, wearables, medical monitors, earbuds, etc. Nanusens’ next generation sensors are a quarter of the size with a package size of only 1mm3.
Even greater space and cost saving can be achieved with Nanusens combo sensors solutions of many different sensors on the same chip with only a tiny increase in package size to 2mm3, giving a space saving of up to 10x compared to the equivalent solution using a set of today’s individual MEMS.
About Nanusens www.nanusens.com
Founded in 2014 by Dr. Josep Montanyà, Dr. Marc Llamas, and Dr Daniel Fernandez, Nanusens is headquartered in London, England with Research and Development offices in Barcelona, Spain and Shenzen, China. It leverages the research and expertise developed by the founders’ previous company, Baolab Microsystems. Nanusens is VC funded by Inveready (www.inveready.com/venture-capital/), Caixa Capital Risc (www.caixacapitalrisc.es/en/) and Dieco Capital (www.dieco-capital.com), and crowdfunding via Crowdcube. Tel +34 935824466 email@example.com
Media contact: Nigel Robson. firstname.lastname@example.org +44 1481 233080
MEMS-within-CMOS™ is a trademark of Nanusens Limited